Appeal No. 2005-1108
Application No. 10/442,900
(specification, page 1). Representative claim 1 reads as
follows:1
1. A wafer carrier for retaining at least one semiconductor
wafer in a processing apparatus during a processing operation
which removes wafer material by at least one of abrading and
chemical reaction, said processing apparatus adapted for removing
wafer material from a front side and a back side of each wafer
simultaneously, the carrier comprising:
a plate including wafer contaminating material and having an
opening and a thickness; and
an insert having a thickness and being disposed in the
opening of the plate for receiving at least one wafer and
engaging a peripheral edge of the wafer to hold the wafer as the
carrier rotates, the thickness of the insert being at least about
20 microns greater than the thickness of the plate to inhibit
removal of the contaminating material from the plate during
processing and thereby inhibit contamination of the wafer.
THE PRIOR ART
The references relied on by the examiner to support the
final rejection are:
Desai et al. 5,422,316 Jun. 06, 1995
(Desai)
Zhang et al. 6,454,635 Sep. 24, 2002
(Zhang)
1
1 In the event of further prosecution, steps should be taken
to correct the lack of proper antecedent basis in claim 5 for the
reference to “the surface area of exposed metal” and the
inconsistency between the preambles of dependent claims 21
through 25 and the subject matter recited in parent claim 20.
2
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