Appeal No. 2005-2353 Page 2
Application No. 10/028,860
BACKGROUND
The appellants' invention relates to the field of integrated circuit packages. ln
particular, the invention relates to an apparatus and method of cooling an integrated
circuit package (specification, p. 1). A copy of the claims under appeal is set forth in the
appendix to the appellants' brief.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Patel 5,396,403 Mar. 7, 1995
Fujisaki et al. (Fujisaki) 5,763,950 June 9, 1998
Lin et al. (Lin) 6,188,578 Feb. 13, 2001
Claims 1, 2, 6, 7, 12 to 16 and 27 to 29 stand rejected under 35 U.S.C. § 102(b)
as being anticipated by Fujisaki.
Claim 4 stands rejected under 35 U.S.C. § 103 as being unpatentable over
Fujisaki in view of Patel.
Claim 5 stands rejected under 35 U.S.C. § 103 as being unpatentable over
Fujisaki in view of Patel and Lin.
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