Appeal No. 2005-2353 Page 5
Application No. 10/028,860
semiconductor element. In this regard, it is possible that the solder connection between
the semiconductor element and the underlying substrate would prevent the cooling fluid
from directly contacting and moving laterally across the bottom surface of the
semiconductor element. As such, claims 1, 2, 6, 7, 12 to 16 and 27 to 29 are not
anticipated by Fujisaki.
For the reasons set forth above, the decision of the examiner to reject claims 1,
2, 6, 7, 12 to 16 and 27 to 29 under 35 U.S.C. § 102(b) is reversed.
The obviousness rejections
We have also reviewed the references to Patel and Lin additionally applied in the
rejection of claims 4 and 5 but find nothing therein which makes up for the deficiency of
Fujisaki discussed above. Accordingly, the decision of the examiner to reject claims 4
and 5 under 35 U.S.C. § 103 is reversed.
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