Ex Parte Koeneman et al - Page 4




               Appeal No. 2005-2353                                                                           Page 4                   
               Application No. 10/028,860                                                                                              



               To establish inherency, the extrinsic evidence must make clear that the missing                                         
               descriptive matter is necessarily present in the thing described in the reference, and that                             
               it would be so recognized by persons of ordinary skill.  Inherency, however, may not be                                 
               established by probabilities or possibilities.  The mere fact that a certain thing may result                           
               from a given set of circumstances is not sufficient.  See In re Robertson, 169 F.3d 743,                                
               745, 49 USPQ2d 1949, 1950-51 (Fed. Cir. 1999).                                                                          


                       The appellants argue that Fujisaki does not disclose a cooling fluid directly                                   
               contacting and moving laterally across the active surface          1 of an integrated circuit die as                    
               set forth in the claims under appeal.  We  agree.  Fujisaki teaches that cooling fluid                                  
               directly contacts and moves laterally across the top surface of the semiconductor                                       
               element.  However, there is no teaching in Fujisaki that the top surface of the                                         
               semiconductor element is an active surface.  In fact, in view of heat fins and heat sinks                               
               being mounted to the top surface, it is likely the top surface of the semiconductor                                     
               element is an inactive surface.   As to the bottom surface of the semiconductor element                                 
               (which appears to be an active surface), there is no disclosure in Fujisaki that the                                    
               cooling fluid can directly contact and move laterally across the bottom surface of the                                  

                       1 The "active surface'' of an integrated circuit die is the side of the integrated                              
               circuit die on which electrical components are formed.  See page 1 of the appellants'                                   
               specification.                                                                                                          








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