Appeal No. 2005-2489
Application No. 09/949,736
19. An apparatus for removing a plastic resin
encapsulant form an encapsulated integrated circuit
comprising:
a chamber having an optical opening, a dispersion
fluid inlet and an exhaust outlet;
a laser mounted on the outside of the chamber and
aligned with the optical opening for directing a laser beam
onto a surface of the encapsulated integrated circuit for
selectively removing portions of the encapsulant; and
means for relatively moving the integrated circuit
with respect to the laser beam.
37. An apparatus for removing encapsulant from a
device [sic] under test (DUT), the apparatus comprising:
a chamber having an optical opening, a dispersion
fluid inlet and an exhaust outlet, the optical opening adapted to
allow a laser to direct a laser beam on a surface of the DUT for
removing portions of the encapsulant;
a stage in the chamber adapted to receive and hold
the DUT; and
a dust bin in the chamber adapted to collect
debris from the removed portions of the encapsulant.
THE PRIOR ART REFERENCES
The examiner relies upon the following prior art references
in support of the Sections 102(b) and 103(a) rejections before
us:
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