Ex Parte Fuentes et al - Page 1



            The opinion in support of the decision being entered today was not        
            written for publication and is not binding precedent of the Board.        

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
            Ex parte ANASTACIO C. FUENTES, JR., REYNALDO S. ATIENZA, JR.              
                               and CHESALON M. CLAVIO                                 
                                    _____________                                     
                                Appeal No. 2006-0312                                  
                             Application No. 10/145,171                               
                                   ______________                                     
                                    ON BRIEF                                          
                                   _______________                                    
          Before KIMLIN, PAK and WALTZ, Administrative Patent Judges.                 
          KIMLIN, Administrative Patent Judge.                                        
                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 10-22.            
          Claims 28-34 have been withdrawn from consideration.  Claim 10 is           
          illustrative:                                                               
                    10.  An apparatus comprising:                                     
                    a grinder to reduce the thickness of a substrate; and             
                    an air ionizing source to direct ionized air onto the             
               substrate prior to dicing of the substrate and after the               
               thickness of the substrate is reduced by the grinder, the              
               ionized air reducing an accumulation of electrostatic charge           
               on the substrate to reduce substrate warpage.                          






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