Appeal No. 2006-0369 Παγε 2
Application No. 10/225,395
can be derived from a reading of exemplary claim 27, which is
reproduced below.
An article for forming a circuit material, comprising
a copper foil and
an adhesion promoting elastomer composition comprising
an ethylene-propylene-diene monomer elastomer, and
a cross-linking agent that does not contain sulfur.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Smyers et al. (Smyers) 3,240,662 Mar. 15, 1966
Urban 4,268,339 May 19, 1981
Valaitis et al. (Valaitis) 4,803,020 Feb. 07, 1989
Yokono et al. (Yokono) 5,569,545 Oct. 29, 1996
Kwei 5,904,707 May 18, 1999
Saruwatari et al. (Saruwatari)1 54-037181 Mar. 19, 1979
(published Japanese Patent Application)
Claims 1, 3, 4, 6-29, 31-42 stand rejected under 35 U.S.C.
§ 112, first paragraph as including subject matter that lacks
1 All references to Saruwatari in this decision are to the
English language translation of the published Japanese
application, of record.
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