The opinion in support of the decision being entered today was not
written for publication and is not binding precedent of the Board
UNITED STATES PATENT AND TRADEMARK OFFICE
_______________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_______________
Ex parte JONG CHEN,
SHYUE SHENG LU and
JYU HORNG SHIEH
______________
Appeal No. 2006-0563
Application 09/941,537
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ON BRIEF
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Before KIMLIN, KRATZ, and TIMM, Administrative Patent Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-3, 7, 8,
10, 11, 13-15 and 17-24. Claim 1 is illustrative:
1. A method for reducing light reflectance from via sidewalls
in a photolithographic trench patterning dual damascene process
comprising the steps of:
providing an inter-metal dielectric (IMD) layer comprising at
least one via opening extending through a thickness thereof;
1
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