Appeal No. 2006-0563
Application 09/941,537
also as a thin conformal ARC layer of about 200-1500 Angstroms thick
(see column 4, lines 33-62 and column 5, lines 27-41). In addition,
Filipiak evidences that it was known in the art to design an ARC
layer only as thick as needed when patterning an overlying
photoresist layer (see column 3, lines 48-55).
Hence, as explained by the examiner, Lin establishes that it
was conventional in the art to use a thin conformal edge barrier
layer 50 of about 1000 Angstrom thickness to cover the sidewalls of
a via without filling it, and Yu and Filipiak teach that the same
materials of similar thickness also serve as an ARC. Accordingly,
we find that it would have been obvious for one of ordinary skill in
the art to employ either option of coating only the sidewalls of a
via with an ARC or to fill the via with an ARC. Moreover, in
keeping with Filipiak’s teaching of keeping the ARC layer only as
thick as needed, we agree with the examiner that one of ordinary
skill in the art would have been properly motivated to form ARC
layer 150 of Lin such that it conformally deposits over the IMD
layer and the via openings without filling the openings (see page 21
of answer). As noted by the examiner, this would save ARC material
and the subsequent removal of Lin’s ARC material.
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