Ex Parte Berman et al - Page 1



          The opinion in support of the decision being entered today was not written                      
                for publication and isnot binding precedent of the Board.                   

                UNITED STATES PATENT AND TRADEMARK OFFICE                             
                              ____________                                            
                    BEFORE THE BOARD OF PATENT APPEALS                                
                            AND INTERFERENCES                                         
                               ____________                                           
                    Ex parte MICHAEL J. BERMAN and JAN FURE                           
                               ____________                                           
                            Appeal No. 2006-0629                                      
                         Application No. 10/668,021                                   
                               ____________                                           
                                 ON BRIEF                                             
                               ____________                                           
        Before GROSS, LEVY, and NAPPI, Administrative Patent Judges.                  
        LEVY, Administrative Patent Judge.                                            

                             DECISION ON APPEAL                                       
            This is a decision on appeal from the examiner's final                    
        rejection of claims 1-9, 19 and 20, which are all of the claims               
        pending in this application.                                                  

        We REVERSE.                                                                   
                               BACKGROUND                                             
            The appellants' invention relates to improving the                        
        uniformity and other process characteristics of chemical                      
        mechanical polishing of integrated circuits (specification,                   













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