Appeal 2006-1078
Application 09/425,694
whereby these treatment steps form a treatment sequence B2,
which avoids rinsing with water or another treatment liquid and the
addition of fresh water or other liquids to the treatment baths.
12. A process for the wet chemical treatment of semiconductor
wafers with treatment liquids in baths, comprising the steps of
firstly treating the semiconductor wafers in a bath with an aqueous
HF solution containing HF and optionally HCI and optionally a surfactant;
then treating the semiconductor wafers in a bath with an aqueous
O3 solution containing O3 and optionally HF; and
then treating the semiconductor wafers in a bath with an aqueous
HCI solution containing HCI and optionally O3;
whereby these treatment steps form a treatment sequence B2; and
circulating the treatment liquids of said bath by taking a part from
each of said baths, filtering and returning the part to the corresponding
treatment bath.
References Relied on by the Examiner
The examiner relies upon the following references as evidence of unpatentability:
Berman 5,014,737 May 14, 1991
Davison 5,593,538 Jan. 14, 1997
Verhaverbeke et al. 6,132,522 Oct. 17, 2000
(Verhaverbeke)
Pirooz et al. EP 0 701 275 Mar. 13, 1996
(Pirooz)
Grounds of Rejection
1. Claims 1-9 and 11 are rejected under 35 U.S.C. § 103(a) as unpatentable
over Pirooz in view of Verhaverbeke.
2. Claims 12-15 are rejected under 35 U.S.C. § 103(a) as unpatentable over
Pirooz in view of Verhaverbeke and further in view of Berman or Davison.
We reverse as to both grounds of rejection.
Background
2
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