Appeal No. 2006-1231 Application No. 10/180,686 12: A device comprising: a substrate; a semiconductor device on said substrate, said semiconductor device comprising an active region comprising silicon; a silicide contact on said active region, said silicide contact comprising a first metal silicide and an additional material, wherein said first metal silicide comprises a metal capable of forming a second metal silicide, wherein an amount of said additional material causes formation of said first metal silicide to be energetically favored over formation of said second metal silicide. THE REFERENCES Anjum et al. (Anjum) 5,470,794 Nov. 28, 1995 Cabral, Jr. et al. (Cabral) 2002/0115262 Aug. 22, 2002 (filed Feb. 21, 2001) Maa et al. (Maa) 6,468,901 Oct. 22, 2002 (filed May 2, 2001) T. Ohguro et al. (Ohguro), “Nitrogen-doped nickel monosilicide technique for deep submicron CMOS salicide”, paper presented at Int’l Electron Devices Meeting, Washington, D.C., Dec. 10-13, 1995, at 453-56. THE REJECTIONS The claims stand rejected as follows: claims 12, 14, 15, 18, 29, 31, 32 and 34 under 35 U.S.C. § 102(b) as anticipated by Ohguro; claims 12, 15, 29 and 32 under 35 U.S.C. § 102(b) as anticipated by Anjum; claims 12-15, 17, 18 and 29-34 under 2Page: Previous 1 2 3 4 5 6 7 8 NextLast modified: November 3, 2007