The opinion in support of the decision being entered today was not written for publication and is not binding precedent of the Board. UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte CHINH NGUYEN, PHU HOANG and ANDY LE, PHAN HOANG ____________ Appeal No. 2006-1449 Application No. 10/404,266 ____________ ON BRIEF ____________ Before HARISTON, JERRY SMITH, and BARRY, Administrative Patent Judges. JERRY SMITH, Administrative Patent Judge. DECISION ON APPEAL This is a decision on the appeal under 35 U.S.C. § 134 from the examiner’s rejection of claims 1-3, 9-11, 17-19, and 25-36, which constitute all the claims pending in this application. The disclosed invention pertains to stacking multiple integrated circuit (IC) devices. Specifically, the top side of a printed circuit board (PCB) is attached to first pins of a first device. A plurality of raised pads are disposed on the bottom side of the PCB and are attached to upper areas of second pins of a second device to electrically connect the first and second pins. Such a technique provides a stable and strong mechanicalPage: 1 2 3 4 5 6 7 8 9 10 11 12 NextLast modified: November 3, 2007