Ex Parte Singh et al - Page 5


                   Appeal No. 2006-2050                                                                                            
                   Application No. 10/045,913                                                                                      
                   of the trench insulator liners (specification, page 7), a “growing” process is discussed                        
                   while, when disclosing the formation of the trench insulator fill layer, a “depositing”                         
                   process is described (specification, page 9).  This disclosed distinction is carried through                    
                   the claim language in which recites the “growing” of the trench insulator liners but the                        
                   “depositing” of the trench insulating fill layer.                                                               
                          In view of the above discussion, it is apparent to us that, since the etched                             
                   component 8 of the trench insulator liner in Shiozawa is disclosed as being deposited by                        
                   chemical vapor deposition rather than being grown, all of the requirements of each of the                       
                   independent claims 1, 15, 16, and 29 are not satisfied.  Accordingly, we do not sustain                         
                   the Examiner’s 35 U.S.C. § 102(e) rejection of independent claims 1, 15, 26, and 29, nor                        
                   of claims 2, 5, 8-10, 19, 23-25, 27, and 32-34 dependent thereon.                                               
                          Turning to a consideration of the Examiner’s 35 U.S.C. § 103(a) rejections of                            
                   claims 3, 4, 6, 7, 16-18, 20-22, 28, 30, 31, and 38-42 in which the Wolf, Lee, and Koike                        
                   references are separately combined with Shiozawa to address, respectively, the wet etch,                        
                   dry etch, and trench rounding features of the rejected claims, we sustain these rejections                      
                   as well.  We find nothing in the Wolf, Lee, and Koike references, taken individually or                         
                   collectively, which would overcome the innate deficiencies of Shiozawa discussed supra.                         













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