Appeal No. 2006-2317
Application No. 10/334,196
Representative independent claim 1 is reproduced below:
1. A method to vertically interface wafer-based microelectronic devices
comprising:
bonding a first device to a second device, each of the first and second devices
comprising a substrate layer having an active layer adjacent a bulk substrate layer
and a series of conductive lines coupled to the active layer, by interfacing the
conductive lines of the first device with the conductive lines of the second device to
provide an electrical connection between the active layer of the first device and the
active layer of the second device;
forming a conductive layer across the bulk substrate layer and a portion of
the active layer of the first device, the conductive layer having a via portion and an
external contact portion, the external contact portion protruding beyond the bulk
substrate layer of the first device, the via portion providing an electrical connection
between the external contact portion and the one of the conductive lines of the first
device.
The following reference is relied on by the examiner:
Patti 6,642,081 Nov. 4, 2003
(Filed April 11, 2002)
Claims 1 through 22, 35, 37 and 38 stand rejected under 35 U.S.C. § 102(e)
as being anticipated by Patti.
2
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