Appeal No. 2006-2317
Application No. 10/334,196
The corresponding discussion in Patti, as to these figures, makes a point of
explaining that a conductive layer of copper extends beyond the substrate layer
(elements 21, 31 and 41 in Patti’s figure 1) as claimed. Additionally, the artisan
may well interpret claim 13 as being met by the features of the mated/bonded
vertical conductors/component conductors themselves as comprising the claimed
internal contacts. Bonding between devices/wafers in Patti occurs at/by surface
contacts 210, 211 in Figures 8 and 9 viewed as “internal” to the stacked wafers.
Lastly, as illustrated in the various figures of Patti, the via 120 and filled via 120
depicted as copper pad 132 in the latter figures extends “across” or through all of or
substantially all of the respectively stacked component layers/wafers 20, 30 and 40
in figure 1 of Patti.
In view of the foregoing, the decision of the examiner rejecting all claims on
appeal under 35 U.S.C. § 102 is affirmed.
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