Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
(1) First, applicants amended rejected independent claim 1 to add
the requirements that the material of the chip carrier is a “glass filled epoxy” and
that “said chip carrier having a coefficient of thermal expansion of at least at least
17 × 10-6 ppm/c°”; amended original application claim 1 ultimately became patent
claim 1.
(2) Second, applicants amended rejected independent claim 7 to
add the requirements that the material of the chip carrier is a “glass filled epoxy”
and that “said chip carrier having a coefficient of thermal expansion of at least at
least 17 × 10-6 ppm/c°”; amended original application claim 7 ultimately became
patent claim 7.
82. In addition, the Examiner based the rejection of claims 21-25 and 34
on the grounds that when faced in the original application with a rejection under
35 U.S.C. § 103 over the Soga and Frankeny prior art patents, applicants made two
insignificant amendments to originally filed claims 1 and 7:
(1) First, applicants amended rejected independent claim 1 to add
the requirement of “an encapsulation material encapsulating said first set of solder
connections”.
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