Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
56. The Examiner further held that:
[The] only issue in question is whether glass filled epoxy circuit
boards possess a coefficient of thermal expansion of at least
17 × 10-6 ppm/°C are known and if so, what would lead one . . .
[to use] an organic material for the circuit board.
57. At pages 3-4 of the Final Action, the Examiner found that: 5
[Ogihara at page 2,] in lines 42-44 in the left column, it states that
circuit boards [having] a coefficient of thermal expansion as large as
15 × 10-7 to 25 × 10-7 ppm/°C. Furthermore, in the same column in
lines 31-41, gives reasons why it is desirable to use an organic
material rather than ceramic material.
58. At pages 3-4 of the Final Action, the Examiner noted that:
Regarding the issue of making the chip carrier from the organic
material too, the examiner draws the applicant’s attention to U.S. Pat.
No. 4,821,142 awarded to Ushifusa et al. wherein col. 5 lines 40-47
there is clear suggestion . . . to make the chip carrier and the circuit
board from the same material and in col. 6 lines 28-31 it is stated that
the chip carrier and the circuit board have substantially the same
thermal coefficient of expansion.
59. On September 15, 1993, applicants filed an Amendment After Final
(“the Amendment After Final”) responding to the Examiner's final action.
5 The Examiner’s holding contains a typographical error. Ogihara actually teaches
150 × 10-7 to 250 × 10-7 ppm/°C which is 15 × 10-6 to 25 × 10-6 ppm/°C. The
original final action shows a correction to the first superscript (changing it from -6
to -7) when in fact it was the second superscript that was in error.
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