Ex Parte GEDNEY et al - Page 13



              Appeal 2006-1454                                                                                         
              Application 09/004,524                                                                                   
              Patent 5,483,421                                                                                         

                     48. In the Amendment, applicants presented no argument with respect to                            
              the patentability of originally filed claims 1-12.                                                       
                     49. In the Amendment at page 8, applicants argued the following as to the                         
              amended and new claims:                                                                                  
                           Turning now to the claims, claim 1 specifically requires that the                           
                     chip carrier be formed of an epoxy filed glass dielectric material, that                          
                     the chip carrier have a thermal coefficient of expansion of at least                              
                     17×10-6 ppm/°C, and requires an encapsulation material encapsulating                              
                     the first set of solder connections (i.e. the connections between the                             
                     chip and the chip carrier) and that the circuit board have a coefficient                          
                     of thermal expansion similar to that of the chip carrier.  It is submitted                        
                     that none of the references cited either alone or in combination teach                            
                     or suggest such a structure.                                                                      
                     50. In the Amendment at page 10, applicants argued with respect to Soga:                          
                     [T]here is no indication that the carrier can be made of this material                            
                     nor is there any indication that the chip carrier can be made of a                                
                     material with a dielectric constant as high as 17 to 20 × 10-6 ppm/c°.                            
                     The most that [Soga] can be said to teach is that a multi-layer                                   
                     substrate of an organic can be used to which the ceramic chip carrier                             
                     is mounted with the carrier having a TCE of 10-15 × 10-6 ppm/°C.                                  
                           This is not what applicants’ invention is. The applicants’                                  
                     invention utilizes a glass filled epoxy substrate having a thermal                                
                     coefficient of expansion greater than 17 × 10-6 ppm/c° as a chip carrier                          
                     with a chip mounted thereon by solder interconnections which are                                  
                     encapsulated[.]  . . .  Soga, et al. teach a carrier of a TCE of 10-15 ×                          
                     10-6 ppm/°C not a material having a TCE over 17 × 10-6 ppm/°C.                                    
                     Thus, it is believed that Soga, et al. clearly does not teach or suggest                          
                     the present invention.                                                                            


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