Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
[Frankeny] teaches using a solder with a higher melting point for the
first connections than the solder for the second connections.
44. The Examiner further found that:
[Soga states] that the carrier (element 9) and the circuit board
(element 2) are made of the same material such that . . . the thermal
coefficient of expansion of the carrier and the circuit board are
approximately equal. Furthermore, [Soga] teaches that the circuit
board may be made from an organic material. Thus both [Frankeny
and Soga] recognize the problem in the art concerning the structure as
claimed and [Soga] goes further to teach that the carrier and the circuit
board are made of the same material which can be an organic
material.
45. The Examiner held that:
[It] would have been obvious to one of ordinary level of skill in the art
to use the solder concept of [Frankeny] on the invention of [Soga] for
the purpose of preventing reflow of the first solder connections when
the second solder connections are heated.
46. On May 26, 1993, applicants filed an Amendment (“the
Amendment”) responding to the Examiner's First Office Action.
47. As shown in Appendix 3 of this opinion, the Amendment:
(1) cancelled claims 3 and 9;
(2) added new claims 13 and 14; and
(3) amended claims 1, 5, 7, and 11.
After entry of the Amendment, the application claims were 1, 2, 4-8, and 10-14.
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