Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
30. The preferred material is an epoxy glass combination usually known
in industry as FR-4; but other materials such as polyimides which have similar
properties can be used. (col. 7, ll. 60-63).
31. Electrical conducting lines 40 (Figure 4) are provided on the surface
of the board with bonding sites 42 formed in an array to correspond to the bonding
pads 32 on the bottom surface 28 of the chip carrier 24 (col. 7, ll. 64-67).
32. The bonding pads 32 are then bonded to the bonding sites 42 by
means of solder balls 44 (col. 8, ll. 1-2).
33. The solder balls 44 can be any solder material (col. 8, ll. 2-3).
34. An encapsulation material 46, such as a quartz filled epoxy of the type
described in U.S. Pat. No. 4,825,284 to Soga et al. can be used to protect and
strengthen the solder connections between the device 20 and carrier 24 (col. 8, ll.
12-15).
B. Prosecution history of the original application
35. As noted earlier, the patent sought to be reissued was based on
Application 07/848,467, filed March 9, 1992 (“original application”).
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