Ex Parte GEDNEY et al - Page 5



              Appeal 2006-1454                                                                                         
              Application 09/004,524                                                                                   
              Patent 5,483,421                                                                                         

                     5. Applicants state at column 2, lines 11-17, that:                                               
                     One attempt to overcome these drawbacks is the so-called direct chip                              
                     attached to the circuit board. This does have many advantages.                                    
                     However, in addition to the thermal mis-match, it does pose certain                               
                     problems, since the spacing of the interconnect pads on the chip are so                           
                     very close that they require very fine line patterns on the substrate to                          
                     which the chip is to be attached.                                                                 
                     6. Applicants state at column 2, lines 50-54, that:                                               
                     Other techniques for attachment of ceramic chip carriers to glass                                 
                     reinforced epoxy circuit boards (FR-4) are shown in IBM Technical                                 
                     Disclosure Bulletin Volume 18, Number 5, Pages 1440-1441 and IBM                                  
                     Technical Disclosure Bulletin Volume 20, Number 8, Pages 3090-                                    
                     3091.                                                                                             
                     7. Applicants further state at column 2, line 55 through                                          
                     column 3, line 4, that:                                                                           
                     In an attempt to overcome the problem of thermal mismatch between                                 
                     the chip carrier and the circuit board it has been proposed to fashion                            
                     the chip carrier from a material similar to that of the circuit board.                            
                     Such techniques are described in IBM Technical Disclosure Bulletin                                
                     Volume 33, Number 2, Pages 15-16 and IBM Technical Disclosure                                     
                     Bulletin Volume 10, Number 12, Pages 1977-1978. However, both of                                  
                     these references require that the connections, at least for the signal I/O                        
                     lines, be on the same side of the carrier as that to which the chip is                            
                     mounted.  . . . These techniques do solve the problem of thermal                                  
                     mismatch between the chip carrier and the circuit board, but they                                 
                     require peripheral I/O bonding and an additional interposer between                               
                     the chip and the chip carrier.                                                                    



                                                         - 5 -                                                         

Page:  Previous  1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  Next

Last modified: September 9, 2013