Appeal 2006-2676
Application 10/341,140
a semiconductor chip; and
a chip mounting substrate having first and second opposing surfaces,
and via holes for penetrating between said first and second surfaces;
said semiconductor chip being mounted on said first surface in
electrical connection with said via holes; said chip mounting substrate
having a thickness t between said surfaces at side via holes; said via holes
having an inner diameter Dv; and said thickness and via holes being
relatively dimensioned according to the following relationship:
Dv-3.75xt+0.095>0.
The following reference is relied on by the Examiner:
Takashima US 6,281,571 B1 Aug. 28, 2001
Claims 1, 2 and 15 stand rejected under 35 U.S.C. § 102(b) as being
anticipated by Takashima. The remaining claims on appeal, claims 3
through 8, stand rejected under 35 U.S.C. § 103. As evidence of
obviousness of these claims, the Examiner relies on Takashima alone.
Rather than repeat the positions of the Appellants and the Examiner,
reference is made to the Brief (no Reply Brief has been filed) for Appellants’
positions, and to the Answer for the Examiner’s positions.
OPINION
We affirm.
At the outset, we note that Appellants present no arguments as to any
dependent claim on appeal, whether rejected under 35 U.S.C. § 102 or 103.
Appellants’ brief arguments at page 4 of the Brief address only the features
of independent claims 1 and 15 on appeal.
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