Ex Parte 6357595 et al - Page 32



                Appeal 2006-3236                                                                                
                Inter Partes Reexamination Control No. 95/000,006                                               

                       The Examiner's Answer maintains the rejection.                                           

                       Analysis                                                                                 
                       In an inter partes reexamination, "no proposed amended or new claim                      
                enlarging the scope of the claims of the patent shall be permitted."                            
                35 U.S.C. § 314(a).  A claim is broader in scope if it includes within its                      
                scope any subject matter that would not have infringed the original patent.                     
                See In re Freeman, 30 F.3d 1459, 1464, 31 USPQ2d 1444, 1447 (Fed. Cir.                          
                1994).  Eliminating a claim limitation usually constitutes a prima facie                        
                broadening because a claim with fewer limitations is normally broader.                          
                However, the claim language must always be analyzed case-by-case.                               
                       Original claim 1 in the '595 patent recites "a first surface of said main                
                body," "a first wall surface," and "said second wall extending away from                        
                said first wall surface in a direction away from said first wall surface of said                
                main body":                                                                                     
                             1.  A tray for storing a semiconductor integrated circuit device                   
                       having a package and wiring terminals on a lower surface of the                          
                       package, said tray comprising:                                                           
                             a substantially planar main body; and                                              
                             a first storage portion provided on a first surface of said main                   
                       body for storing the semiconductor integrated circuit device, said first                 
                       storage portion having a bottom surface and a first wall surface                         
                       extending from said bottom surface and arranged around the                               
                       semiconductor integrated circuit device when the semiconductor                           
                       integrated device is stored in said first storage portion;                               

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