Ex Parte 6357595 et al - Page 42



                Appeal 2006-3236                                                                                
                Inter Partes Reexamination Control No. 95/000,006                                               

                surface 28 in the '595 patent.  As discussed in Issue (3), the limitation of "a                 
                second wall surface disposed around a circumference of the semiconductor                        
                integrated circuit device so as to limit horizontal movement of the                             
                semiconductor integrated circuit device" does not define how much, or                           
                under what conditions the second wall surface limits horizontal movement.                       
                       The term "surface" has a broad meaning in the '595 patent and may                        
                include several distinct surfaces, e.g., the "upper surface" of the tray ('595                  
                patent, col. 3, ll. 36-43) includes all the surfaces of the storage portions on                 
                the top of the tray, including the claimed "bottom surface," "first wall                        
                surface," and "second wall surface."  Accordingly, the claimed "bottom"                         
                surface may be considered to include and extend from the bottommost                             
                horizontal surface to the lower edge of the inclined surface as shown in the                    
                Requester's figure.                                                                             
                       Brahmbhatt's structure is capable of storing a semiconductor                             
                integrated circuit device as claimed.  Claims 1 and 16 are anticipated.                         
                       Brahmbhatt recognizes that the surface of the tray should not come                       
                into contact with the solder balls of the integrated circuit package (col. 1,                   
                ll. 55-65).  Therefore, the inclined guide-in surface in Figure 17 leading to                   
                the seating surface would necessarily be angled to prevent the surface from                     
                coming into contact with the ball terminals as the package is being inserted                    
                and would not contact the ball terminals of a package sitting on the inclined                   
                surface as recited in claim 2.  The angles of the inclined surface and the                      
                vertical surface in Figure 17 anticipate the limitations of claims 9-11.                        

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