Appeal 2006-3247
Application 10/345,055
A. INVENTION
The invention at issue on appeal inspects surfaces of specimens such
as semiconductor wafers. Fabrication of semiconductor devices such as
logic and memory devices includes a number of processes to form various
features and multiple levels or layers that comprise semiconductor devices
on the surface of a semiconductor wafer, or similar substrate. During each
semiconductor fabrication process, defects such as particulate contamination
and pattern defects may be introduced into the surface of the wafer.
(Specification 1.)
Accordingly, the Appellants' invention employs a contact image
sensor ("CIS") to inspect the surfaces of specimens and to detect
"macroscopic defects," i.e., defects having lateral dimensions of at least tens
of microns. (Id. 14.) They assert that use of the CIS minimizes the size of
their invention and permit its integration into other semiconductor
processing equipment. The CIS, add the Appellants, also minimizes effects
due to the optical geometry of the invention, e.g., lack of telecentricity. (Id.)
Claim 24, which further illustrates the invention, follows:
24. A method for measurement and inspection of a specimen,
comprising:
2
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