Appeal 2006-3357
Application 10/310,311
memory module (SIMM) (Specification [0006]), but points out that
“none of those devices disclose the use of a socket for removably
mounting a minimally packaged semiconductor device to a circuit
board” (emphasis added) (Specification [0007]). Accordingly,
Appellants distinguish between a “minimally packaged semiconductor
device” and a daughter board, which may include more than one
semiconductor device permanently attached thereto, but do not
distinguish between a “semiconductor device” and a daughter board.
4. Bellomo provides an edge card interconnection system having
enhanced electrical interconnection between the module and a circuit
board. The disclosed system minimizes electrical contact length and
controls deflection of contacts, as the system is configured to
eliminate the need for the contacts to absorb module thickness
tolerances. Bellomo’s system further includes a latching mechanism
that is easily manipulated and facilitates extraction of the module.
(Bellomo, col. 2, ll. 33-42.)
5. Bellomo’s edge card interconnection system 30 includes a connector
portion 32 that is electrically engageable with a main module or
circuit board 33. The connector portion 32 includes internal contacts
for receiving and facilitating edge card connection with contact pads
34 disposed along an edge of a module 36 to be electrically
interconnected with the main module or circuit board 33. The module
36 includes a plurality of electronic circuits such as memory modules
38. The module 36 is attached to a module latching and protection
mechanism 40 by mechanical fastening means. The module latching
and protection mechanism 40 includes latching arms (illustrated but
5
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: September 9, 2013