Appeal 2007-0053
Application 10/225,829
delivering surface mount electronic components such as memory chips, integrated
circuit chips, resistors, connectors, microprocessors, capacitors, gate arrays, and
the like (Bird, col. 9, ll. 28-33 and col. 10, ll. 33-37).
4. Bird does not disclose at least one weakened feature extending across
the width of the component-carrier tape and located between an adjacent pair of
apertures.
5. Bird discusses that removal of material for the component openings
and advancement holes reduces the inherent strength of the strip portion, and
teaches that one practicing the invention should preferably use a polymeric foam
having a sufficient tensile strength to compensate for the reduced strength resulting
from the removed material. Rather than discouraging the removal of material from
the strip portion, Bird teaches compensating for the openings and holes by
selecting the appropriate polymeric foam (Bird, col. 7, ll. 15-29).
6. Appellant admits that Yanagisawa teaches a strip that includes a
plurality of tape substrates and low bending resistance portions located between
adjacent tape substrates to prevent bending of the tape substrates and, thus,
bending of leads of the tape substrates (Br. 6).
7. Yanagisawa teaches a flexible base substrate 10 having a plurality of
first regions 44 and a plurality of second regions 45 (Yanagisawa, col. 5, ll. 58-60).
8. Yanagisawa teaches that a device hole 14 is formed within each first
region 44, and the second region 45 is positioned between two adjacent first
regions 44 (Yanagisawa, col. 6, ll. 9-15).
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