Appeal 2007-0053
Application 10/225,829
9. Yanagisawa teaches that at least one low-bending-resistance portion
40 is formed within each second region 45 to ensure that the second region 45
bends more readily than the first region 44, such as when the assembly is being
wound on a reel (Yanagisawa, col. 6, ll. 39-47).
10. Yanagisawa teaches that the low-bending-resistance portions 40
ensure that when the base substrate 10 is being bent, such as when it is being
wound, bending stresses concentrate in the second regions 45, avoiding bending
stress concentrations at the first regions 44 (Yanagisawa, col. 6, ll. 47-51).
11. Yanagisawa teaches that the low-bending-resistance portions 40 can
be slits formed to extend across the width of the base substrate 10, through-holes
cuts, or thinner portions, or formed of a material that is weaker than the material of
the first regions 44 (Yanagisawa, col. 6, ll. 53-59).
12. The purpose of the low-bending-resistance portions of Yanagisawa is
to prevent the leads connected to a semiconductor chip in each first region 44 from
bending when the flexible interconnect substrate 10 is wound onto a reel for reel-
to-reel processing (Yanagisawa, col. 1, ll. 22-24).
13. The general problem facing the inventor at the time of the invention
was to improve the handling characteristics of component-bearing tape as it is
loaded with components, rolled into a reel, transported, and unrolled for removing
components from the tape (Specification 3:[0006] - 4:[0010]).
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