Appeal 2007-0619
Application 10/178,008
3. Kumar describes that its stamp master (mold surface) may be prepared
by various known techniques. Specifically, Kumar teaches (col. 9, ll. 47-54)
that:
In its broadest sense, mold surface 42 may comprise any
surface having morphological features that may desirably serve
as a template for the formation of a stamp, hence the patterning
of a molecular species on a surface. For example, a
microelectronic device such as a chip may serve as a template,
as may any other corrugated or indented surface. Mold surface
42 may be formed according to a variety of ways. [Emphasis
added.]
Kumar then goes on to exemplify two techniques, i.e., micromachining and
lithography (col. 9, l. 54 to col. 10, l. 13).
4. Shepard, like Kumar, is directed to fabricating microelectronic
devices having feature sizes ranging from hundreds of nanometers to
microns (col. 1, ll. 14-39 and col. 4, ll. 21-22). Shepard teaches fabricating
microelectronic devices via a molding process that employs, inter alia, an
injection molded stamp master (master copy) (col. 3, l. 55 to col. 4, l. 12).
Specifically, Shepard teaches (col. 3, l. 56 to col. 4, l. 26) that:
Devices in accordance with the invention may be
fabricated using a molding process, which obviates the need to
etch a recessed pattern into each substrate. Such a process is
illustrated in FIG. 1. With reference to FIG. 1, a “master”
substrate is etched with the recessed pattern …Variations on the
electroforming of the master copy could include depositing on
that master copy material intended to appear in the face of the
mold, following which the mold is chemically or physically
separated from the master following deposition.
4
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: September 9, 2013