Appeal 2007-1019
Application 09/851,231
an etched open microchannel in said etched substrate,
an annealed substrate positioned on said etched substrate that covers
said etched microchannel in said etched substrate,
an annealed open microchannel in said annealed substrate over said
etched microchannel in said etched substrate, and
a bond connecting said etched substrate to said annealed substrate,
wherein said etched open microchannel and said annealed open
microchannel comprise said sealed open microchannel.
The Examiner relies upon the following reference in the rejection of
the appealed claims:
Cammack US 5,574,327 Nov. 12, 1996
Appellants’ claimed invention is directed to an apparatus comprising a
substrate having a microchannel etched therein and a substrate having
formed therein an annealed open microchannel. A bond connects the etched
substrate to the annealed substrate. Claims 17-19 recite the claimed
apparatus in product-by-process format.
Appealed claims 11, 13-15, 17, and 19 stand rejected under 35 U.S.C.
§ 102(b) as being anticipated by Cammack. Claims 12, 16, and 18 stand
rejected under 35 U.S.C. § 103(a) as being unpatentable over Cammack.
We have thoroughly reviewed each of Appellants arguments for
patentability. However, we find that the Examiner’s rejections are well
founded and in accord with current patent jurisprudence. Since we find
ourselves in complete agreement with the Examiner’s reasoned analysis and
application of the prior art, as well as her cogent disposition of the
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