Ex Parte Steinecke et al - Page 1

                  The opinion in support of the decision being entered today is not binding                  
                                           precedent of the Board.                                           

                         UNITED STATES PATENT AND TRADEMARK OFFICE                                           
                              BEFORE THE BOARD OF PATENT APPEALS                                             
                                          AND INTERFERENCES                                                  
                          Ex parte THOMAS STEINECKE and FRANZ LOHMAIR                                        
                                              Appeal 2007-1711                                               
                                           Application 10/657,898                                            
                                           Technology Center 2800                                            
                                           Decided: July 31, 2007                                            
                Before LEE E. BARRETT, ANITA PELLMAN GROSS, and                                              
                MARC S. HOFF, Administrative Patent Judges.                                                  
                GROSS, Administrative Patent Judge.                                                          

                                          DECISION ON APPEAL                                                 
                                        STATEMENT OF THE CASE                                                
                      Steinecke and Lohmair (Appellants) appeal under 35 U.S.C.  134                        
                from the Examiner's Final Rejection of claims 1 through 3, 6 through 13, 16,                 
                and 17.                                                                                      
                      Appellants' invention generally relates to a semiconductor wafer in                    
                which the metallization layers are optimized such that automatic wiring can                  

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