Appeal 2007-1711
Application 10/657,898
be done with "place+route" programs. See Specification page 3, lines 11-16.
Claim 1 is illustrative of the claimed invention, and it reads as follows:
1. An electronic device, comprising:
a semiconductor chip having an active top side with a plurality of contact
areas;
said semiconductor chip having a plurality of metallization layers and a
plurality of insulation layers configured alternately one above another on
said active top side;
said plurality of metallization layers including topmost metallization layers
having a plurality of voltage supply structures and lower metallization layers
disposed underneath said topmost metallization layers and having a plurality
of signal line structures;
said plurality of insulation layers formed with a plurality of passage contacts
connecting said plurality of voltage supply structures and/or said plurality of
signal line structures to said plurality of contact areas of said active top side;
said topmost metallization layers having ones of said plurality of passage
contacts connected to said plurality of contact areas;
said topmost metallization layers having at least a first one of said plurality
of voltage supply structures for a low supply potential and a second one of
said plurality of voltage supply structures for a high supply potential;
said first one of said plurality of voltage supply structures being insulated
from said second one of said plurality of voltage supply structures;
said first one of said plurality of voltage supply structures of said topmost
metallization layers having a grid of supply interconnects configured parallel
to one another;
said second one of said plurality of voltage supply structures of said topmost
metallization layers having a grid of supply interconnects configured parallel
to one another; and
2
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Last modified: September 9, 2013