Appeal 2007-1727
Application 10/836,916
Appellants' invention relates to a heat spreader for thermally enhanced
semiconductor packages. See generally Specification 1:4-6. Claim 1 is
illustrative of the claimed invention, and it reads as follows:
1. An electronic device comprising:
a substrate carrier;
a semiconductor connected to the substrate carrier;
a heat spreader having a body portion with a perimeter, a lower surface, and
a number of legs formed from the body portion of the heat spreader,
interior to the perimeter of the body portion, recessed below the body
portion, and attached to the substrate carrier, wherein:
the distance between the substrate carrier and the lower surface of the body
portion of the heat spreader defines a Z-dimension; and
the Z-dimension is maintained constant over substantially the entire surface
area of the body portion of the heat spreader except proximate the
legs.
The prior art references of record relied upon by the Examiner in
rejecting the appealed claims are:
Houle US 6,469,381 B1 Oct. 22, 2002
Appellants' Admitted Prior Art (AAPA)
Claims 1, 3, 4, 6 through 8, 11 through 14, and 18 through 20 stand
rejected under 35 U.S.C. § 112, second paragraph, as being indefinite.
Claims 1, 3, 4, 6 through 8, 11 through 14, and 18 through 20 stand
rejected under 35 U.S.C. § 103 as being unpatentable over Houle .
Claims 5 and 11 through 15 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Houle in view of AAPA.
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