Ex Parte Akram - Page 3




             Appeal 2007-2304                                                                                    
             Application 10/209,004                                                                              

                                             THE REFERENCES                                                      
             Sandhu                                            US 5,381,302                              Jan. 10, 1995
             Hosaka (as translated)                     JP  62-115767                             May 27, 1987   

                                              THE REJECTION                                                      
                   Claims 2 and 4-11 stand rejected under 35 U.S.C. § 103 as being                               
             unpatentable over Sandhu in view of Hosaka.                                                         

                                                   OPINION                                                       
                   We affirm the aforementioned rejection.                                                       
                   The Appellant indicates that the claims stand or fall in three groups:                        
             1) claims 2, 4-6 and 10; 2) claims 7 and 9; and 3) claims 8 and 11 (Br. 8).  We                     
             therefore limit our discussion to one claim in each group, i.e., claims 2, 7 and 8.                 
             See In re Ochiai, 71 F.3d 1565, 1566 n.2, 37 USPQ2d 1127, 1129 n.2 (Fed. Cir.                       
             1995); 37 CFR § 41.37(c)(1)(vii)(2004).                                                             
                                                Claims 2 and 7                                                   
                   Sandhu discloses a method for forming a storage node electrode of a                           
             capacitor in a dynamic random access memory (DRAM) device, comprising                               
             forming an insulating layer (40; figure 3), forming a contact (65) in the insulating                
             layer (figure 5), forming an electrode layer (85) on the insulating layer and the                   


                                                                                                                
             art capacitor 10 shown in Fig. 1” (Spec. 22:18-23).                                                 
                                                       3                                                         



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