Appeal 2007-2342
Application 10/884,654
DISCUSSION
“Integrated circuits (ICs) have typically been assembled into
electronic packages by physically and electrically coupling them to a
substrate made of organic or ceramic material” (Spec. 1: 13-15). “A typical
package includes an IC, such as a die, that is mounted on an interposer
which functionally connects the die through a hierarchy of electrically
conductive paths to the other elements, such as other ICs, that make up the
electronic system” (Spec. 2: 3-6).
To address circuitry problems, such as loop induction, capacitors are
typically attached to the underside of a thin interposer (Spec. 2: 18-25; Fig.
2). “[T]he thin interposer leads to another problem as the thin interposer is
unable to handle the mechanical loads that are applied by the heat sinks
which are typically used to cool the integrated circuit” (Spec. 2: 25-27).
“The present invention provides a solution to thickness, weight, and/or
rigidity limitations in an electronic package, and to loop induction problems
that are associated with prior art electronic packages” (Spec. 4: 26-28). The
cavity on the underside of the interposer is filled with “encapsulant [such as
an epoxy] . . . [which] supports the thin interposer . . . in the area of the
cavity . . . such that the package . . . is capable of withstanding the
mechanical load that is applied to the package . . . by heat sinks and other
thermal elements within the electronic assembly where the package . . . is
located” (Spec. 5: 13-19).
The issue in this appeal is whether the Examiner erred in concluding
that it would have been obvious to persons of ordinary skill in the art to have
modified the method of producing the prior art electronic package (Spec.,
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