Appeal No. 96-0523
Application 07/910,763
claims 1 and 8 and are "external supply and ground terminal
electrode pads on an outer peripheral portion of said
semiconductor wafer," as recited in claim 12. Stopper shows
power grid bonding pads 8 at the edge of the chip in figure 5
(col. 4, line 12; col. 12, approx. lines 29-37, discussing
putting pads for voltage and ground at the side of the chip)
which are "supply and ground pad electrodes" on each of the
die. Stopper does not expressly show the power grid connected
to voltage and ground pad electrodes on the individual chips;
however, it would have been obvious to one of ordinary skill
in the art to interconnect the rails of the power grid to the
voltage and ground pad electrodes because that is the way
power is supplied to the chip.
Because the two rail power grid connects all of the
individual die on the wafer together, see figure 4, the grid
is used "for simultaneously supplying an identical signal or
voltage to all of said semiconductor chips on said
semiconductor wafer," as recited in claim 1. Appellant argues
"that neither of Stopper et al. nor Quinn et al. provide an
arrangement via which the very same voltage or signal could be
simultaneously supplied to each of die or chip on the wafer in
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