Appeal No. 94-3349
Application 07/757,085
expected to draw therefrom. See In re Boe, 355 F.2d 961, 965,
148 USPQ 507, 510 (CCPA 1966); and In re Preda, 401 F.2d 825,
826, 159 USPQ 342, 344 (CCPA 1968).
Claims 9, 10, 34 and 36-40 stand or fall together while
claim 33 is considered by appellants to be separately patentable
(brief at page 3).
Claim 33
We find that Blonder discloses, as depicted in Figures
1 and 2, V-shaped grooves for connecting a conductor pattern on a
substrate 101 in an electrically conducting manner to an
additional member 10 (Col. 2, lines 28-51). Blonder also
discloses that instead of grooves, texturing of the surface of
chip pad 24 can be obtained by forming columns, pyramids or other
protrusions and that vertical sidewalls rather than V grooves may
be used (Col. 9, lines 37-42 and 51-54). Blonder teaches that
the grooves or protrusions produce a mechanically reliable cold-
welded room-temperature bond between the chip pad 24 and the
carrier pad 10 (Col. 6, lines 8-15).
In one embodiment, the grooves may form a nested L's
pattern when viewed from the top as depicted in Figure 5. Each L
pattern is formed by two grooves at right angles to one another.
Blonder further discloses that the distance between adjacent L's
-5-
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