Appeal No. 94-3349
Application 07/757,085
Blonder to connect the electrodes in Kubo. We disagree. As both
Blonder and Kubo teach structures in which a chip is electrically
connected to another member, it would have been obvious to use
the grooves or protrusions disclosed in Blonder in the Kubo
device to obtain a reliable cold-welded bond and to overcome the
problems associated with solder bonds (Col. 2, lines 8-34).
In view of the foregoing, the decision of the examiner
rejecting claims 9, 10, 33, 34 and 36-40 under 35 U.S.C. § 103 is
affirmed.
No time period for taking any subsequent action in
connection with this appeal may be extended under 37 CFR
1.136(a).
AFFIRMED
JERRY SMITH )
Administrative Patent Judge )
)
)
)
LEE E. BARRETT ) BOARD OF PATENT
Administrative Patent Judge ) APPEALS AND
) INTERFERENCES
)
)
MURRIEL E. CRAWFORD )
Administrative Patent Judge )
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