and 38 to 45. The examiner has allowed claim 37 and appellants
have canceled claims 7 to 10, 16 to 25 and 30 to 33.
Representative claim 1 is reproduced below:
1. A packaged device, comprising:
a semiconductor die;
a lead frame positioned around said die;
a filler material continuous from said die to said
lead frame; and
at least one conductive bond lead formed on said filler
material from a bond pad on said die to said lead frame.
The reference relied on by the examiner is:
Lai et al. (Lai) 4,888,634 Dec. 19, 1989
Claims 1 to 6, 11 to 15, 26 to 29, 34 to 36 and 38 to 45
stand rejected under 35 U.S.C. ' 103. As evidence of
obviousness, the examiner relies on Lai alone.
Rather than repeat the positions of the appellants and the
examiner, reference is made to the brief and the answer for the
respective details thereof.
OPINION
At the outset, we make reference to a prior decision of this
Board, Appeal No. 93-1672, issued on July 15, 1993, in which we
affirmed the rejection of most of the claims on appeal under
35 U.S.C. ' 103 in a parent case to this application. In light
of the reasoning presented there as to certain dependent claims
presently still pending in this application as well as the
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007