Appeal No. 95-2483
Application 08/098,008
environments. Column 1, lines 14 to 27, line 66 to column 2,
line 29.
We also agree with examiner=s reasoning as to the second
argument presented by appellants relating to the at least one
conductive bond lead being formed on the filler material from a
bond pad on the die itself to the lead frame. We agree with the
examiner=s reasoning at page 3 of the answer that the bond leads
shown in Figure 2 of Lai are shown to be Aon@ the filler material
22 at the point of the interface of the plastic packaging
material 24 and the filler material 22, which itself supports the
conductive leads of the wire of the bond leads shown. The
examiner has properly amplified this reasoning somewhat at page 5
of the answer by indicating that the surface of the filler
material 22 is at the boundary where the filler 22 and
encapsulating plastic packaging material 24 touch. Thus, the
conductive bond lead labeled in the Figure 2 version of Lai is
Aon@ the surface of the filler material at least at the point or
arcuate region where the lead is in contact with both the filler
material 22 and the plastic packaging material 24. Thus, in this
sense, the embedding of the bond leads in the curable bonding
material 22 and in the encapsulating plastic material 24 makes it
Aon@ some portion of both of them.
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