Appeal No. 95-2483
Application 08/098,008
18 is continuous between the bottom of the chip 10 and the top
surface of the supporting substrate 12. Moreover, the binder 16
alone in Figure 1 is shown to be continuous in this relationship
between the bottom region of the chip 10 and the top region of
the supporting substrate 12 since it is shown to be continuous
interstitially between the glass spheres 18 between these
regions. Although a lead frame is not shown, per se, in Figure
1, it would have been apparent to the artisan that the basic
structural arrangement just described with respect to Figure 1
applies to the lead frame embodiments shown in Figure 2 of Lai.
Even in a horizontal sense, there is filler material
comprising the curable bonding material 22 and the encapsulating
plastic package material 24 between the left and right edge
portions of the chip 20 in Figure 2 of Lai and the horizontal
showing of the legs of the lead frame horizontally adjacent
thereto. There are no air gaps in that region. To the extent
the claim may be interpreted as requiring that the same filler
material be present in this horizontal sense, it would have been
obvious to the artisan to increase the uniform thermal resistance
characteristics of the chip 20 embedded in the bonding material
22 by extending this thermal resistant binder material 22 to the
edges of the lead frame legs, particularly in higher power device
4
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Last modified: November 3, 2007