Appeal No. 95-3348
Application 07/944,967
The Rejection on Appeal
Claims 1 and 4 stand rejected under 35 U.S.C. § 103 as being
unpatentable over Shiga and the prior art acknowledged in the
appellant's specification..
The Invention
The invention is directed to a combination lead frame and
pressure sensor assembly. A die pad exists for the mounting of a
load member thereon, comprising one main die pad and two
auxiliary die pads. The auxiliary die pads are separate from and
disposed on opposite sides of the main die pad. There is an
outer frame having four sides. The supporting leads for the main
die pad are connected to a first side of the frame and the
supporting leads for the auxiliary die pads are connected to a
second side of the frame opposite the first side. Also, the
supporting leads for the main die pad and for the two auxiliary
die pads extend inwardly from the frame in opposite directions.
According to the appellant, a structure according to the
present invention provides more vertical stability in the
mounting of a load element on the die pad.
Independent claim 1 is reproduced below:
1. A lead frame and pressure sensor assembly comprising:
a unitary lead frame including:
-3-
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Last modified: November 3, 2007