Appeal No. 95-3348
Application 07/944,967
an annular outer frame having four sides and lying in a
first plane;
a die pad disposed within said frame comprising one
main die pad and two auxiliary die pads separate from
and disposed on opposite sides of said main die pad,
said main and auxiliary die pads being commonly
disposed in a second plane spaced from the first plane;
a main die pad supporting lead connected to a first
side of said frame and to said main die pad and two
auxiliary die pad supporting leads connected to a
second side of said frame opposite the first side of
said frame and to said two auxiliary die pads,
respectively, each supporting lead having a
predetermined length so that said main die pad and said
two auxiliary die pads lie in the second plane, said
main die pad supporting lead and said auxiliary die pad
supporting leads respectively extending inwardly from
said frame in opposite directions;
at least one connecting lead extending inwardly from
said frame for establishing an electrical connection to
an element mounted on said main die pad and said two
auxiliary die pads; and
a semiconductor pressure detecting element mounted on
said main die pad and said two auxiliary die pads.
Opinion
The rejection of claims 1 and 4 cannot be sustained.
The examiner notes that the prior art discussed in the
appellant's specification does not include auxiliary pads
(answer at 3). With respect to Shiga, the examiner stated
(answer at 3-4):
In figures 1B and 1E, Shiga et al. teach a lead
frame including an annular outer frame having at least
-4-
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007