Appeal No. 95-0638
Application 08/011,094
This is a decision on the appeal under 35 U.S.C. § 134
from the examiner's rejection of claims 1-15, 36-43, 45-49 and
74-89. Claim 44 has been cancelled. Claims 16-35 and 50-73
stand withdrawn from consideration by the examiner as being
directed to a nonelected invention. An amendment after the first
action final rejection in this case was filed on June 28, 1993
and was entered by the examiner. This amendment resulted in the
removal of a rejection of claim 1 under the second paragraph of
35 U.S.C. § 112.
The disclosed invention pertains to the field of power
microwave generating transistor modules and power transistor
packages. These modules and packages generate a substantial
amount of heat which limits the density of components which can
be interconnected in a given space. Appellants have discovered
that the conventional metallic heat dissipation layers can be
replaced by copper layers of a specific thickness which improve
the dissipation of heat so that the density of the device and the
applied power can be increased without a corresponding increase
in the temperature of the device.
Representative claim 75 is reproduced as follows:
75. A power transistor package, comprising:
a metallic base member;
2
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