Appeal No. 95-0638
Application 08/011,094
a substrate having a ceramic core with first and
second opposite planar surfaces, each of the planar surfaces
having a layer of copper with a thickness in the range of
approximately 0.5 to 7 mils bonded to each of the planar surfaces
by a metallic film;
a layer of nickel having a thickness substantially
less than the copper layer plated on the copper layer, at least a
portion of the first planar surface being electrically isolated
from the base member for supporting a plurality of power
transistors, the copper layer having the characteristics and
thickness to spread heat from power microwave transistors mounted
on the electrically isolated planar surface, the second planar
surface being brazed to the metallic base member; and
a frame assembly brazed to a metallic surface
surrounding and spaced from the electrically isolated planar
surface of the substrate for connecting electrically at least two
terminals exterior the respective package, the two terminals
being electrically isolated from the substrate and the base
member and from each other.
The examiner relies on the following references:
Freedman et al. (Freedman) 3,814,633 June 04, 1974
Kurihara et al. (Kurihara ’899) 4,556,899 Dec. 03, 1985
Kurihara et al. (Kurihara ’733) 59-175733 Oct. 04, 1984
(Japanese Kokai)
The admitted prior art of appellants’ Figure 13.
Claims 1-15, 36-43, 45-49 and 74-89 stand rejected under
35 U.S.C. § 103. As evidence of obviousness the examiner offers
the admitted prior art of appellants’ Figure 13 in view of the
teachings of either Kurihara ’733 or Freedman. Claims 76-79
stand additionally rejected based on the admitted prior art in
view of Kurihara ’899.
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