Appeal No. 95-2500
Application No. 07/984,147
This is an appeal from the final rejection of claims 41,
43 and 69-85, all the claims remaining in the present
application. Claim 41 is illustrative:
41. A package for housing a microelectronic circuit,
comprising:
a plastic housing;
a leadframe partially encapsulated within said plastic
housing;
a microelectronic device electrically interconnected to
said leadframe; and
a composite heat spreader at least partially embedded in
said plastic housing, said composite heat spreader comprising
a core layer and first and second cladding layers bonded to
opposing sides of said core layer.
In addition to the admitted state of the prior art found
in appellants' specification, the examiner relies upon the
following references as evidence of obviousness:
Hodge 3,930,114 Dec. 30, 1975
Gernitis et al. (Gernitis) 4,025,997 May 31, 1977
Hascoe 4,283,464 Aug. 11, 1981
Komatsu et al. (Komatsu) 4,298,883 Nov. 3, 1981
Hynes et al. (Hynes) 4,320,412 Mar. 16, 1982
Kato et al. (Kato) 4,521,801 Jun. 4, 1985
Yerman et al. (Yerman) 4,635,092 Jan. 6, 1987
Alvarez et al. (Alvarez) 4,811,166 Mar. 7, 1989
Butt 5,001,546Mar. 19, 1991
Appellants' claimed invention is directed to an
electronic package comprising a plastic housing, having
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