Appeal No. 95-2500
Application No. 07/984,147
therein a micro-electronic device electrically interconnected
to a leadframe and a composite heat spreader. The heat
spreader comprises a core layer situated between first and
second cladding layers. The composite heat spreader has a
high thermal conductivity to enhance the removal of heat
during the operation of the microelectronic device, in
addition to having a coefficient of thermal expansion
essentially equal to that of the electronic device in order to
inhibit thermal fracture of the device.
Appealed claims 41, 43 and 69-74 stand rejected under
35 U.S.C. § 103 as being unpatentable over the admitted prior
art, Hodge and Komatsu in view of Gernitis, Hascoe or Alvarez.
Claims 75 and 76 stand rejected under 35 U.S.C. § 103 as being
unpatentable over the stated combination of references in
further view of Kato, Butt, Yerman or Hynes.
Upon careful consideration of the opposing arguments
presented on appeal, we are of the opinion that the applied
prior art fails to establish a prima facie case of obviousness
for the claimed subject matter. Accordingly, we will not
sustain the examiner's rejections.
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