Appeal No. 95-5041
Application No. 08/163,967
above the substrate but beyond the junction extension 7a
(column 2, lines 1 through 5).
The first field shield plate 16e is linked to conductive
plates 16a through 16d (column 2, lines 5 through 15).
According to Terashima (column 2, lines 27 through 50):
The conductive plate 16a is fixed at the low
potential of the p-type separation diffusion region
13, and the conductive plate 16e is fixed at the
high potential of the n-type diffusion region 11.
The floating conductive plates 16b, 16c and 16d are
fixed at certain potentials by a first capacitance
between the conductive plates 16a to 16e and a
second capacitance between the aluminum wiring 15
and the respective conductive plates 16a to 16e . .
. . Thus, it is possible to prevent concentration
of electric fields caused in the end region 7a of
the island 7, particularly on its surface, through
influence exerted by an electric field from the
high-potential aluminum interconnection 15 . . . .
Thus, the island 7 . . . is increased in breakdown
voltage.
Appellant argues (Brief, pages 7 and 8) that:
With respect to the Examiner’s rejection of the
claims . . . , the Examiner appears to have combined
Terashima plates 16b, 16c and 16d, i.e. the
“floating plates”, with fixed conductive plate (16e)
to create a “combination plate”, and has treated
this “combination plate” as an equivalent to
applicant’s first field shield plate 30 in an effort
to show that the junction extension region of
Terashima extends beyond the far edge of the
“combination plate”, i.e. beyond the left edge of
plate 16b in FIG. 3 of the reference. However,
there is absolutely no support or teaching for the
9
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 Next
Last modified: November 3, 2007