Appeal No. 1996-0203
Application No. 08/006,414
This is an appeal under 35 U.S.C. § 134 from the
examiner's refusal to allow claims 1 through 12, 29 and 30,
all the claims remaining in the application.
THE INVENTION
The claimed invention is directed to a structure which is
a multilayer thin film interconnect known as a compensator.
The compensators are said to achieve improved electrical
performance and dimensional stability compared to prior art
compensators.
Claim 1 is believed to be adequately representative of
the appealed subject matter and is reproduced below for a more
facile understanding of appellants' invention.
1. A compensator interconnect structure used in
forming a multilayer thin-film structure, said
compensator comprising at least one metal layer,
said metal layer having at least one opening, at
least one layer of at least one polymer conformally
coating said metal layer and lining said at least
one opening, and wherein said opening has at least
one via metal stud.2
Additionally, to aid in understanding the claimed subject
Claim 1 reproduced above does not include the term2
"transferrable" in either the first or third lines of
claim 1 as reproduced in appellants' brief. We shall
discuss this issue below.
2
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